Max. number of layers:

1-30Layers

Max. board sizes:

1020 mm *1024mm 500*1200mm

Min. conductor /
spacing width:

Standard: 0.15 mm (6 mil): tolerance +/-20%
Special: 0.10 mm (4 mil): tolerance +/-10%

Min. hole sizes:

Standard: 0.30 mm
Special: 0.20 mm
PTH hole tolerance +/-0.076 mm
NPTH hole tolerance +/-0.05 mm

Basic materials:

FR4

Copper thickness:

18.35, 70, 100, 137,206,403 µm + Cu plating

Board thickness:

Standard: 0.50mm,0.60mm,0.80mm, 1.00mm, 1.20mm, 1.50mm, 1.60mm, 2.00mm, 3.00mm,3.2mm,4.0mm.5.0mm.6.0mm,8.0mm

Board surface finish:

HASL(lead free), gold, OSP,Ni/Au,Immersion tin and silver

Solder mask:

photographic-mask, UV or thermal cured mask

Silk screen printing:

Standard: White, Green
Special: Yellow, Black,Aureate,Blue

V-scoring:

Standard: 0.4mm – 05.0mm

 

Standard: Flying Probe Test

Special: Impedance,A shortocircuit test,A test for governance

Required documentation:

Specification + mechanical drawings + data (Gerber files or CAM350)+ drilling files (Excelon) ,CAD protel99se PADS

Delivery cycle

Single side sample Standad:3-4days,batch:7-8days

Double-four layers standad:8-9days,batch:9-10

Six-eight layers:10-20days

Exceed eight layers:15-20days